Quality System and Control

I. Quality Management System

SiFirst has obtained the ISO9001 international standard quality management system certification, which systematizes the drive for excellent operations and customer trust.

1.      Quality Policy:

Quality first, reputation paramount, continuous improvement, customer satisfaction.

2.      Documentation System:

An integrated four-in-one system ensures consistent and standardized process execution.

3.  Environmental Commitment:

Comply with environmental regulations and implement sustainable development.

4.  System Certification:

SiFirst's management system has passed the authoritative third-party certification for the ISO 9001:2015 Quality Management System. This is not only a compliance with international standards, but also a third-party testimony of our continuous commitment to product and service quality.      

 II. Supplier Quality Management:

SiFirst regards suppliers as an extension of quality and has established a robust and trustworthy supply chain ecosystem through four core management practices:

1.  Rigorous Selection

Implement multi-dimensional qualification reviews to ensure high standards at the outset of cooperation.

2.  Aligned Commitment

Unify expectations and solidify the foundation of cooperation through clear quality agreements and technical specifications.

3.  Intelligent Control

Rely on a data-driven incoming material inspection and performance monitoring system to achieve precise control.

4.  Collaborative Advancement

Commit to collaborative improvement and joint growth with suppliers to drive sustainable supply chain development.

III. Product Reliability Control

The chip is the core of the system, and its reliability is of vital importance. Therefore, we have established a reliability management system that spans the entire life cycle from design, manufacturing, packaging and testing to the market, featuring “prevention - verification - monitoring - improvement.”

1.  Built-in Reliability in Design

Adopt the most stringent reliability standards in the architecture and circuit design phase. Through reliability simulation and electro-thermal stress analysis, potential failure risks such as over-electricity, thermal load, and gate oxide breakdown are avoided at the source.

2.  Reliability Assurance in Manufacturing Process

Work in deep collaboration with the wafer foundry to conduct statistical process control on key process parameters and monitor the process window. Ensure that every link, including wafer manufacturing, CP testing, and packaging, complies with reliability process specifications to prevent the introduction of defects.

3.  Systematic Reliability Verification

Follow the JEDEC standard to carry out reliability tests that far exceed the standards of the consumer electronics industry, covering the entire process from product reliability to packaging reliability.

4.  Market Failure Analysis and Rapid Closed Loop

Establish an efficient failure analysis channel and database to conduct root cause analysis of any market failure and close the loop by feeding back improvement measures to the design, manufacturing, and testing stages, driving continuous reliability evolution.